特性
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Wide supply voltage range from 1.8 V to 5.5 V
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Typical tpd of 3.0 ns at 5 V
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Typical VOL(p)< 0.8 V at VCC = 3.3 V, Tamb = 25 °C
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Typical VOH(v)> 2.3 V at VCC = 3.3 V, Tamb = 25 °C
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Supports mixed-mode voltage operation on all ports
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IOFF circuitry provides partial Power-down mode operation
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Latch-up performance exceeds 250 mA per JESD 78 Class II
- ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 3000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 2000 V
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74AHCV541ABQ | Production | 1.8 - 5.5 | CMOS | ± 16 | 60 | 8 | low | -40~125 | 79 | 51 | DHVQFN20 |
74AHCV541APW | Production | 1.8 - 5.5 | CMOS | ± 16 | 60 | 8 | low | -40~125 | 101 | 45 | TSSOP20 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74AHCV541ABQ | DHVQFN20 (SOT764-1) | SOT764-1 | SOT764-1_115 | Active | AHCV541A | 74AHCV541ABQX ( 9353 067 98115 ) | |
74AHCV541APW | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_118 | Active | AHV541A | 74AHCV541APWJ ( 9353 066 48118 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74AHCV541ABQ | 74AHCV541ABQX | 74AHCV541ABQ | Always Pb-free | ||
74AHCV541APW | 74AHCV541APWJ | 74AHCV541APW | Always Pb-free |
文档 (6)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AHCV541A | Octal buffer/line driver; 3-state | Data sheet | 2023-09-25 |
ahcv541a | 74AHCV541A IBIS model | IBIS model | 2016-03-23 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
订购、定价与供货
样品
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