特性
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High collector current capability IC and ICM
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Reduced Printed-Circuit Board (PCB) area requirements
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Exposed heat sink for excellent thermal and electrical conductivity
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AEC-Q101 qualified
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Two current gain selections
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Leadless very small SMD plastic package with medium power capability
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Suitable for Automatic Optical Inspection (AOI) of solder joint
目标应用
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Linear voltage regulators
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Battery driven devices
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MOSFET drivers
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High-side switches
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Power management
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Amplifiers
参数类型
Type number | Package version | Package name | Size (mm) | Polarity | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | Tj [max] (°C) | fT [min] (MHz) |
---|---|---|---|---|---|---|---|---|---|---|---|
BC69-16PAS | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | PNP | 420 | -20 | -2000 | 100 | 250 | 150 | 40 |
BC69-25PAS | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | PNP | 420 | -20 | -2000 | 160 | 375 | 150 | 40 |
BC69PAS | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | PNP | 420 | -20 | -2000 | 85 | 375 | 150 | 40 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
BC69-16PAS | DFN2020D-3 (SOT1061D) | SOT1061D | REFLOW_BG-BD-1 | SOT1061D_115 | Active | C2 | BC69-16PASX ( 9340 681 12115 ) |
BC69-25PAS | DFN2020D-3 (SOT1061D) | SOT1061D | REFLOW_BG-BD-1 | SOT1061D_115 | Active | C3 | BC69-25PASX ( 9340 681 13115 ) |
BC69PAS | DFN2020D-3 (SOT1061D) | SOT1061D | REFLOW_BG-BD-1 | SOT1061D_115 | Active | C1 | BC69PASX ( 9340 681 11115 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
BC69-16PAS | BC69-16PASX | BC69-16PAS | Always Pb-free | ||
BC69-25PAS | BC69-25PASX | BC69-25PAS | Always Pb-free | ||
BC69PAS | BC69PASX | BC69PAS | Always Pb-free |
文档 (5)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
BC69PAS_Nexperia_Product_Quality | BC69PAS Nexperia Product Quality | Quality document | 2019-05-20 |
BC69PAS_Nexperia_Product_Reliability | BC69PAS Nexperia Product Reliability | Quality document | 2024-04-22 |
BC69PAS | BC69PAS SPICE model | SPICE model | 2024-03-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
SOT1061D | plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-10-10 |
订购、定价与供货
样品
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