特性
- High current
- Three current gain selections
- High power dissipation capability
- Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)
- Leadless very small SMD plastic package with medium power capability (SOT1061)
- AEC-Q101 qualified
目标应用
- Linear voltage regulators
- High-side switches
- Battery-driven devices
- Power management
- MOSFET drivers
- Amplifiers
参数类型
Type number | Package version | Package name | Size (mm) | Polarity | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | Tj [max] (°C) | Automotive qualified |
---|---|---|---|---|---|---|---|---|---|---|---|
BC52-10PA | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | PNP | 420 | -60 | -1000 | 63 | 160 | 150 | Y |
BC52-16PA | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | PNP | 420 | -60 | -1000 | 63 | 250 | 150 | Y |
BC52PA | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | PNP | 420 | -60 | -1000 | 63 | 250 | 150 | Y |
BCP52 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 650 | -60 | -1000 | 63 | 250 | 150 | Y |
BCP52-10 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 650 | -60 | -1000 | 63 | 160 | 150 | Y |
BCP52-16 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 650 | -60 | -1000 | 63 | 250 | 150 | Y |
BCX52 | SOT89 | SOT89 | 4.5 x 2.5 x 1.5 | PNP | 500 | -60 | -1000 | 63 | 250 | 150 | Y |
BCX52-10 | SOT89 | SOT89 | 4.5 x 2.5 x 1.5 | PNP | 500 | -60 | -1000 | 63 | 160 | 150 | Y |
BCX52-16 | SOT89 | SOT89 | 4.5 x 2.5 x 1.5 | PNP | 500 | -60 | -1000 | 63 | 250 | 150 | Y |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
BC52-10PA | DFN2020-3 (SOT1061) | SOT1061 | REFLOW_BG-BD-1 | SOT1061_115 | Active | BT | BC52-10PA,115 ( 9340 658 18115 ) |
BC52-16PA | DFN2020-3 (SOT1061) | SOT1061 | REFLOW_BG-BD-1 | SOT1061_115 | Active | BU | BC52-16PA,115 ( 9340 658 19115 ) |
BC52PA | DFN2020-3 (SOT1061) | SOT1061 | REFLOW_BG-BD-1 | SOT1061_115 | Active | BS | BC52PA,115 ( 9340 658 17115 ) |
BCP52 | SC-73 (SOT223) | SOT223 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT223_135 | Active | BCP52 | BCP52,135 ( 9339 173 00135 ) |
BCP52-10 | SC-73 (SOT223) | SOT223 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT223_135 | Active | BCP52 /10 | BCP52-10,135 ( 9339 173 10135 ) |
BCP52-16 | SC-73 (SOT223) | SOT223 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT223_115 | Active | BCP52 /16 | BCP52-16,115 ( 9339 173 20115 ) |
BCX52 | (SOT89) | SOT89 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT89_115 | Active | AE | BCX52,115 ( 9332 722 90115 ) |
BCX52-10 | (SOT89) | SOT89 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT89_115 | Active | AG | BCX52-10,115 ( 9336 630 50115 ) |
BCX52-16 | (SOT89) | SOT89 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT89_135 | Active | AM | BCX52-16,135 ( 9336 747 20135 ) |
SOT89_115 | Active | AM | BCX52-16,115 ( 9336 747 20115 ) |
停产信息
型号 | 可订购的器件编号,(订购码(12NC)) | 最后一次购买日期 | 最后一次交货日期 | 替代产品 | 状态 | 备注 |
---|---|---|---|---|---|---|
BCP52 | 933917300115 | |||||
BCP52/A | 934061073135 | |||||
BCP52/A2 | 934062843135 | |||||
BCP52-10 | 933917310115 | |||||
BCP52-16/A | 934061074115 | |||||
BCP52-16/A2 | 934062844115 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
BC52-10PA | BC52-10PA,115 | BC52-10PA | Always Pb-free | ||
BC52-16PA | BC52-16PA,115 | BC52-16PA | Always Pb-free | ||
BC52PA | BC52PA,115 | BC52PA | Always Pb-free | ||
BCP52 | BCP52,135 | BCP52 | week 34, 2003 | ||
BCP52-10 | BCP52-10,135 | BCP52-10 | week 34, 2003 | ||
BCP52-16 | BCP52-16,115 | BCP52-16 | week 34, 2003 | ||
BCX52 | BCX52,115 | BCX52 | week 28, 2003 | ||
BCX52-10 | BCX52-10,115 | BCX52-10 | week 28, 2003 | ||
BCX52-16 | BCX52-16,135 | BCX52-16 | Always Pb-free | ||
BCX52-16 | BCX52-16,115 | BCX52-16 | week 28, 2003 |
文档 (10)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
BCP52_BCX52_BC52PA | 60 V, 1 A PNP medium power transistors | Data sheet | 2018-08-28 |
LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
SOT1061 | plastic, leadless thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-05-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
SOT89 | plastic, surface-mounted package; 3 leads; 1.5 mm pitch; 4.5 mm x 2.5 mm x 1.5 mm body | Package information | 2022-05-28 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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