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74LVC574A

Octal D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger; 3-state

The 74LVC574A is an 8-bit positive-edge triggered D-type flip-flop with 3-state outputs. The device features a clock (CP) and output enable (OE) inputs. The flip-flops will store the state of their individual D-inputs that meet the set-up and hold time requirements on the LOW-to-HIGH clock (CP) transition. A HIGH on OE causes the outputs to assume a high-impedance OFF-state. Operation of the OE input does not affect the state of the flip-flops. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 1.2 to 3.6 V

  • CMOS low power consumption

  • Direct interface with TTL levels

  • Overvoltage tolerant inputs to 5.5 V

  • High-impedance when VCC = 0 V

  • 8-bit positive edge-triggered register

  • Independent register and 3-state buffer operation

  • Flow-through pin-out architecture

  • IOFF circuitry provides partial Power-down mode operation

  • Complies with JEDEC standard:

    • JESD8-7A (1.65 V to 1.95 V)

    • JESD8-5A (2.3 V to 2.7 V)

    • JESD8-C/JESD36 (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74LVC574ABQProduction1.2 - 3.6CMOS/LVTTL± 243.2150low-40~125799.550DHVQFN20
74LVC574ADProduction1.2 - 3.6CMOS/LVTTL± 243.2150low-40~1258527.661SO20
74LVC574APWProduction1.2 - 3.6CMOS/LVTTL± 243.2150low-40~1251014.745TSSOP20

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC574ABQ
DHVQFN20
(SOT764-1) 		SOT764-1SOT764-1_115ActiveLVC574A74LVC574ABQ,115
( 9352 735 17115 )
74LVC574AD
SO20
(SOT163-1) 		SOT163-1WAVE_BG-BD-1
SOT163-1_118Active74LVC574AD74LVC574AD,118
( 9352 190 30118 )
74LVC574APW
TSSOP20
(SOT360-1) 		SOT360-1SSOP-TSSOP-VSO-WAVE
SOT360-1_118ActiveLVC574A74LVC574APW,118
( 9352 190 50118 )

下表中的版本已停产。参见表 停产信息 了解更多信息。

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC574AD
SO20
(SOT163-1) 		SOT163-1WAVE_BG-BD-1
SOT163-1_112Withdrawn / End-of-life74LVC574AD74LVC574AD,112
( 9352 190 30112 )
74LVC574APW
TSSOP20
(SOT360-1) 		SOT360-1SSOP-TSSOP-VSO-WAVE
SOT360-1_112Withdrawn / End-of-lifeLVC574A74LVC574APW,112
( 9352 190 50112 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74LVC574AD9352190301122021-12-312022-06-3074LVC574AD
    74LVC574APW9352190501122021-12-312022-06-3074LVC574APW

      环境信息

      型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
      74LVC574ABQ74LVC574ABQ,11574LVC574ABQAlways Pb-free
      74LVC574AD74LVC574AD,11874LVC574ADweek 30, 2004
      74LVC574APW74LVC574APW,11874LVC574APWweek 7, 2005

      下表中的版本已停产。参见表 停产信息 了解更多信息。

      型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
      74LVC574AD74LVC574AD,11274LVC574ADweek 30, 2004
      74LVC574APW74LVC574APW,11274LVC574APWweek 7, 2005
      品质及可靠性免责声明

      文档 (11)

      文件名称标题类型日期
      74LVC574AOctal D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger; 3-stateData sheet2023-11-10
      AN263Power considerations when using CMOS and BiCMOS logic devicesApplication note2023-02-07
      AN11009Pin FMEA for LVC familyApplication note2019-01-09
      lvc574alvc574a IBIS modelIBIS model2013-04-07
      Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
      lvclvc Spice modelSPICE model2013-05-06
      SOT764-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm bodyPackage information2022-06-21
      SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
      SOT360-1plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm bodyPackage information2022-06-21
      SOT163-1plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm bodyPackage information2022-06-20
      WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

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      如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

      模型

      文件名称标题类型日期
      lvc574alvc574a IBIS modelIBIS model2013-04-07
      lvclvc Spice modelSPICE model2013-05-06

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