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74LVC1G80

Single D-type flip-flop; positive-edge trigger

The 74LVC1G80 is a single positive-edge triggered D-type flip-flop. Data at the D-input that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition will be stored in the flip-flop and its complement will appear at the Q output. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 1.65 V to 5.5 V

  • Overvoltage tolerant inputs to 5.5 V

  • High noise immunity

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power dissipation

  • Direct interface with TTL levels

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 250 mA

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C.

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74LVC1G80GMProduction1.65 - 5.5CMOS/LVTTL± 322.4450low-40~1253137.8158XSON6
74LVC1G80GNProduction1.65 - 5.5CMOS/LVTTL± 322.4450low-40~12533823.5210XSON6
74LVC1G80GSProduction1.65 - 5.5CMOS/LVTTL± 322.4450low-40~12532529.9218XSON6
74LVC1G80GVProduction1.65 - 5.5CMOS/LVTTL± 322.4450low-40~12527063.3169TSOP5
74LVC1G80GWProduction1.65 - 5.5CMOS/LVTTL± 322.4450low-40~12531180.9181TSSOP5
74LVC1G80GXProduction1.65 - 5.5CMOS/LVTTL± 322.4450low-40~12532794.5195X2SON5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC1G80GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveVT74LVC1G80GM,132
( 9352 772 01132 )
SOT886_115ActiveVT74LVC1G80GM,115
( 9352 772 01115 )
74LVC1G80GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveVT74LVC1G80GN,132
( 9352 917 93132 )
74LVC1G80GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveVT74LVC1G80GS,132
( 9352 929 21132 )
74LVC1G80GV
TSOP5
(SOT753) 		SOT753REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125ActiveV8074LVC1G80GV,125
( 9352 720 23125 )
74LVC1G80GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActiveVT74LVC1G80GW,125
( 9352 686 76125 )
74LVC1G80GX
X2SON5
(SOT1226-3) 		SOT1226-3SOT1226-3_125ActiveVT74LVC1G80GX,125
( 9352 983 84125 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74LVC1G80GW935268676165
74LVC1G80GW935268676115
74LVC1G80GW935268676118

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC1G80GM74LVC1G80GM,13274LVC1G80GMAlways Pb-free
74LVC1G80GM74LVC1G80GM,11574LVC1G80GMAlways Pb-free
74LVC1G80GN74LVC1G80GN,13274LVC1G80GNAlways Pb-free
74LVC1G80GS74LVC1G80GS,13274LVC1G80GSAlways Pb-free
74LVC1G80GV74LVC1G80GV,12574LVC1G80GVweek 36, 2003
74LVC1G80GW74LVC1G80GW,12574LVC1G80GWweek 36, 2003
74LVC1G80GX74LVC1G80GX,12574LVC1G80GXAlways Pb-free
品质及可靠性免责声明

文档 (23)

文件名称标题类型日期
74LVC1G80Single D-type flip-flop; positive-edge triggerData sheet2023-08-18
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11009Pin FMEA for LVC familyApplication note2019-01-09
lvc1g8074LVC1G80 IBIS modelIBIS model2014-10-20
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
lvclvc Spice modelSPICE model2013-05-06
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT753MAR_SOT753 TopmarkTop marking2013-06-03
SOT753plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm bodyPackage information2022-05-31
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

支持

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模型

文件名称标题类型日期
lvc1g8074LVC1G80 IBIS modelIBIS model2014-10-20
lvclvc Spice modelSPICE model2013-05-06

样品

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