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74LVC1G79

Single D-type flip-flop; positive-edge trigger

The 74LVC1G79 is a single positive-edge triggered D-type flip-flop. Data at the D-input that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition will be stored in the flip-flop and appear at the Q output. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 1.65 V to 5.5 V

  • Overvoltage tolerant inputs to 5.5 V

  • High noise immunity

  • CMOS low power dissipation

  • ±24 mA output drive (VCC = 3.0 V)

  • Direct interface with TTL levels

  • Latch-up performance exceeds 250 mA

  • IOFF circuitry provides partial Power-down mode operation

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C.

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74LVC1G79GMProduction1.65 - 5.5CMOS/LVTTL± 322.2450low-40~1253137.8158XSON6
74LVC1G79GNProduction1.65 - 5.5CMOS/LVTTL± 322.2450low-40~12533823.5210XSON6
74LVC1G79GSProduction1.65 - 5.5CMOS/LVTTL± 322.2450low-40~12532529.9218XSON6
74LVC1G79GVProduction1.65 - 5.5CMOS/LVTTL± 322.2450low-40~12527063.3169TSOP5
74LVC1G79GWProduction1.65 - 5.5CMOS/LVTTL± 322.2450low-40~12531180.9181TSSOP5
74LVC1G79GXProduction1.65 - 5.5CMOS/LVTTL± 322.2450low-40~12532794.5195X2SON5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC1G79GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveVP74LVC1G79GM,132
( 9352 771 98132 )
SOT886_115ActiveVP74LVC1G79GM,115
( 9352 771 98115 )
74LVC1G79GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveVP74LVC1G79GN,132
( 9352 917 92132 )
74LVC1G79GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveVP74LVC1G79GS,132
( 9352 929 19132 )
74LVC1G79GV
TSOP5
(SOT753) 		SOT753REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125ActiveV7974LVC1G79GV,125
( 9352 720 20125 )
74LVC1G79GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActiveVP74LVC1G79GW,125
( 9352 686 75125 )
74LVC1G79GX
X2SON5
(SOT1226-3) 		SOT1226-3SOT1226-3_125ActiveVP74LVC1G79GX,125
( 9352 983 83125 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74LVC1G79GW935268675165
74LVC1G79GW935268675115
74LVC1G79GW935268675118

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC1G79GM74LVC1G79GM,13274LVC1G79GMAlways Pb-free
74LVC1G79GM74LVC1G79GM,11574LVC1G79GMAlways Pb-free
74LVC1G79GN74LVC1G79GN,13274LVC1G79GNAlways Pb-free
74LVC1G79GS74LVC1G79GS,13274LVC1G79GSAlways Pb-free
74LVC1G79GV74LVC1G79GV,12574LVC1G79GVweek 36, 2003
74LVC1G79GW74LVC1G79GW,12574LVC1G79GWweek 36, 2003
74LVC1G79GX74LVC1G79GX,12574LVC1G79GXAlways Pb-free
品质及可靠性免责声明

文档 (23)

文件名称标题类型日期
74LVC1G79Single D-type flip-flop; positive-edge trigger Data sheet2023-08-18
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11009Pin FMEA for LVC familyApplication note2019-01-09
lvc1g7974LVC1G79 IBIS modelIBIS model2014-10-20
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
lvclvc Spice modelSPICE model2013-05-06
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT753MAR_SOT753 TopmarkTop marking2013-06-03
SOT753plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm bodyPackage information2022-05-31
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

支持

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模型

文件名称标题类型日期
lvc1g7974LVC1G79 IBIS modelIBIS model2014-10-20
lvclvc Spice modelSPICE model2013-05-06

样品

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