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74LVC1G34

Single buffer

The 74LVC1G34 is a single buffer. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 1.65 V to 5.5 V

  • Overvoltage tolerant inputs to 5.5 V

  • High noise immunity

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power dissipation

  • Latch-up performance exceeds 250 mA

  • IOFF circuitry provides partial Power-down mode operation

  • Direct interface with TTL levels

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
74LVC1G34GMProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125320163XSON6
74LVC1G34GNProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125358222XSON6
74LVC1G34GSProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125341231XSON6
74LVC1G34GVProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125278175TSOP5
74LVC1G34GWProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125319188TSSOP5
74LVC1G34GXProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125345211X2SON5
74LVC1G34GX4Production1.65 - 5.5CMOS/LVTTL± 321751low-40~125--X2SON4

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC1G34GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveYN74LVC1G34GM,132
( 9352 771 84132 )
SOT886_115ActiveYN74LVC1G34GM,115
( 9352 771 84115 )
74LVC1G34GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveYN74LVC1G34GN,132
( 9352 902 39132 )
74LVC1G34GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveYN74LVC1G34GS,132
( 9352 929 12132 )
74LVC1G34GV
TSOP5
(SOT753) 		SOT753REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125ActiveYN74LVC1G34GV,125
( 9352 805 75125 )
74LVC1G34GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActiveYN74LVC1G34GW,125
( 9352 805 76125 )
74LVC1G34GX
X2SON5
(SOT1226-3) 		SOT1226-3SOT1226-3_125ActiveYN74LVC1G34GX,125
( 9352 983 81125 )
74LVC1G34GX4
X2SON4
(SOT1269-2) 		SOT1269-2SOT1269-2_147ActiveYN74LVC1G34GX4Z
( 9356 900 06147 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC1G34GM74LVC1G34GM,13274LVC1G34GMAlways Pb-free
74LVC1G34GM74LVC1G34GM,11574LVC1G34GMAlways Pb-free
74LVC1G34GN74LVC1G34GN,13274LVC1G34GNAlways Pb-free
74LVC1G34GS74LVC1G34GS,13274LVC1G34GSAlways Pb-free
74LVC1G34GV74LVC1G34GV,12574LVC1G34GVAlways Pb-free
74LVC1G34GW74LVC1G34GW,12574LVC1G34GWAlways Pb-free
74LVC1G34GX74LVC1G34GX,12574LVC1G34GXAlways Pb-free
74LVC1G34GX474LVC1G34GX4Z74LVC1G34GX4week 25, 2019
品质及可靠性免责声明

文档 (23)

文件名称标题类型日期
74LVC1G34Single bufferData sheet2023-08-18
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11009Pin FMEA for LVC familyApplication note2019-01-09
lvc1g3474LVC1G34 IBIS modelIBIS model2018-05-25
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27
SOT1269-2plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm bodyPackage information2020-08-18
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT753MAR_SOT753 TopmarkTop marking2013-06-03
SOT753plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm bodyPackage information2022-05-31
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

支持

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模型

文件名称标题类型日期
lvc1g3474LVC1G34 IBIS modelIBIS model2018-05-25

样品

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