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74LVC1G19

1-of-2 decoder/demultiplexer

The 74LVC1G19 is a 1-of-2 decoder/demultiplexer with a common output enable. This device buffers the data on input A and passes it to the outputs 1Y (true) and 2Y (complement) when the enable (E) input signal is LOW. A HIGH E causes both outputs to assume a HIGH state.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices in a mixed 3.3 V and 5 V environment.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 1.65 V to 5.5 V

  • Overvoltage tolerant inputs to 5.5 V

  • High noise immunity

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power dissipation

  • Latch-up performance exceeds 250 mA

  • Direct interface with TTL levels

  • IOFF circuitry provides partial Power-down mode operation

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C.

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74LVC1G19GMProduction1.65 - 5.5CMOS/LVTTL± 321.8low-40~1253147.9159XSON6
74LVC1G19GNProduction1.65 - 5.5CMOS/LVTTL± 321.8low-40~12534224.3212XSON6
74LVC1G19GSProduction1.65 - 5.5CMOS/LVTTL± 321.8low-40~12532830.8220XSON6
74LVC1G19GVProduction1.65 - 5.5CMOS/LVTTL± 321.8low-40~12525760.2169TSOP6
74LVC1G19GWProduction1.65 - 5.5CMOS/LVTTL± 321.8low-40~12528254.1169TSSOP6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC1G19GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_115ActiveVY74LVC1G19GM,115
( 9352 780 79115 )
SOT886_132ActiveVY74LVC1G19GM,132
( 9352 780 79132 )
74LVC1G19GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveVY74LVC1G19GN,132
( 9352 917 82132 )
74LVC1G19GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveVY74LVC1G19GS,132
( 9352 929 07132 )
74LVC1G19GV
TSOP6
(SOT457) 		SOT457REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT457_125ActiveV1974LVC1G19GV,125
( 9352 734 69125 )
74LVC1G19GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125ActiveVY74LVC1G19GW,125
( 9352 734 68125 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74LVC1G19GM935278079125

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC1G19GM74LVC1G19GM,11574LVC1G19GMAlways Pb-free
74LVC1G19GM74LVC1G19GM,13274LVC1G19GMAlways Pb-free
74LVC1G19GN74LVC1G19GN,13274LVC1G19GNAlways Pb-free
74LVC1G19GS74LVC1G19GS,13274LVC1G19GSAlways Pb-free
74LVC1G19GV74LVC1G19GV,12574LVC1G19GVAlways Pb-free
74LVC1G19GW74LVC1G19GW,12574LVC1G19GWAlways Pb-free
品质及可靠性免责声明

文档 (19)

文件名称标题类型日期
74LVC1G191-of-2 decoder/demultiplexerData sheet2023-08-16
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11009Pin FMEA for LVC familyApplication note2019-01-09
lvc1g1974LVC1G19 IBIS modelIBIS model2014-10-20
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT457MAR_SOT457 TopmarkTop marking2013-06-03
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT457plastic, surface-mounted package (SC-74; TSOP6); 6 leadsPackage information2023-03-03
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
lvc1g1974LVC1G19 IBIS modelIBIS model2014-10-20

样品

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