特性
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Wide supply voltage range from 1.0 to 5.5 V
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Optimized for low voltage applications: 1.0 V to 3.6 V
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CMOS low power dissipation
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Direct interface with TTL levels
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Typical output ground bounce < 0.8 V at VCC = 3.3 V and Tamb = 25 °C
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Typical HIGH-level output voltage (VOH) undershoot: > 2 V at VCC = 3.3 V and Tamb = 25 °C
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Demultiplexing capability
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Multiple input enable for easy expansion
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Ideal for memory chip select decoding
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Active LOW mutually exclusive outputs
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Complies with JEDEC standards
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JESD8-7 (1.65 V to 1.95 V)
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JESD8-5 (2.3 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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JESD36 (4.5 V to 5.5 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74LV138BQ | Production | 1.0 - 5.5 | TTL | ± 12 | 12 | low | -40~125 | 83 | 6.5 | 50 | DHVQFN16 |
74LV138D | Production | 1.0 - 5.5 | TTL | ± 12 | 12 | low | -40~125 | 81 | 4.5 | 39.5 | SO16 |
74LV138PW | Production | 1.0 - 5.5 | TTL | ± 12 | 12 | low | -40~125 | 115 | 2.2 | 43 | TSSOP16 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74LV138BQ | DHVQFN16 (SOT763-1) | SOT763-1 | SOT763-1_115 | Active | LV138 | 74LV138BQ,115 ( 9352 855 77115 ) | |
74LV138D | SO16 (SOT109-1) | SOT109-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT109-1_118 | Active | 74LV138D | 74LV138D,118 ( 9350 631 90118 ) |
74LV138PW | TSSOP16 (SOT403-1) | SOT403-1 | SSOP-TSSOP-VSO-WAVE | SOT403-1_118 | Active | LV138 | 74LV138PW,118 ( 9351 743 90118 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
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74LV138BQ | 74LV138BQ,115 | 74LV138BQ | Always Pb-free | ||
74LV138D | 74LV138D,118 | 74LV138D | week 6, 2004 | ||
74LV138PW | 74LV138PW,118 | 74LV138PW | week 17, 2005 |
文档 (10)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LV138 | 3-to-8 line decoder/demultiplexer; inverting | Data sheet | 2024-01-23 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
lv | lv Spice model | SPICE model | 2013-05-06 |
SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
样品
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