特性
- Wide supply voltage range from 2.0 to 6.0 V
- CMOS low power dissipation
- High noise immunity
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Input levels:
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For 74HC74: CMOS level
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For 74HCT74: TTL level
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Symmetrical output impedance
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High noise immunity
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Balanced propagation delays
- Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|
74HC74BQ | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 14 | 82 | low | -40~125 | 106 | 20.9 | 74 | DHVQFN14 |
74HC74D | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 14 | 82 | low | -40~125 | 108 | 20.1 | 66 | SO14 |
74HC74PW | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 14 | 82 | low | -40~125 | 141 | 7.8 | 67 | TSSOP14 |
74HCT74BQ | Production | 4.5 - 5.5 | TTL | ± 4 | 15 | 59 | low | -40~125 | 106 | 20.9 | 74 | DHVQFN14 |
74HCT74D | Production | 4.5 - 5.5 | TTL | ± 4 | 15 | 59 | low | -40~125 | 108 | 20.1 | 66 | SO14 |
74HCT74PW | Production | 4.5 - 5.5 | TTL | ± 4 | 15 | 59 | low | -40~125 | 141 | 7.8 | 67 | TSSOP14 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74HC74BQ | DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | HC74 | 74HC74BQ,115 ( 9352 736 72115 ) | |
74HC74D | SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_653 | Active | 74HC74D | 74HC74D,653 ( 9337 133 80653 ) |
74HC74PW | TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | HC74 | 74HC74PW,118 ( 9351 751 30118 ) |
74HCT74BQ | DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | HCT74 | 74HCT74BQ,115 ( 9352 736 15115 ) | |
74HCT74D | SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_653 | Active | 74HCT74D | 74HCT74D,653 ( 9337 133 90653 ) |
74HCT74PW | TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | HCT74 | 74HCT74PW,118 ( 9351 751 50118 ) |
下表中的版本已停产。参见表 停产信息 了解更多信息。
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74HC74D | SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_652 | Withdrawn / End-of-life | 74HC74D | 74HC74D,652 ( 9337 133 80652 ) |
74HCT74D | SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_652 | Withdrawn / End-of-life | 74HCT74D | 74HCT74D,652 ( 9337 133 90652 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74HC74BQ | 74HC74BQ,115 | 74HC74BQ | Always Pb-free | ||
74HC74D | 74HC74D,653 | 74HC74D | week 13, 2005 | ||
74HC74PW | 74HC74PW,118 | 74HC74PW | week 10, 2005 | ||
74HCT74BQ | 74HCT74BQ,115 | 74HCT74BQ | Always Pb-free | ||
74HCT74D | 74HCT74D,653 | 74HCT74D | week 30, 2004 | ||
74HCT74PW | 74HCT74PW,118 | 74HCT74PW | week 10, 2005 |
下表中的版本已停产。参见表 停产信息 了解更多信息。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74HC74D | 74HC74D,652 | 74HC74D | week 13, 2005 | ||
74HCT74D | 74HCT74D,652 | 74HCT74D | week 30, 2004 |
文档 (13)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74HC_HCT74 | Dual D-type flip-flop with set and reset; positive edge-trigger | Data sheet | 2024-04-02 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
hc74 | 74HC74 IBIS model | IBIS model | 2022-10-21 |
hct74 | 74HCT74 IBIS model | IBIS model | 2022-10-21 |
hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
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