特性
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Wide supply voltage range from 2.0 V to 6.0 V
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CMOS low power dissipation
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High noise immunity
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
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Input levels:
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For 74HC373: CMOS level
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For 74HCT373: TTL level
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3-state non-inverting outputs for bus oriented applications
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Common 3-state output enable input
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ESD protection:
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HBM JESD22-A114F exceeds 2 kV
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MM JESD22-A115-A exceeds 200 V
-
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Multiple package options
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74HC373BQ | Production | 2.0 - 6.0 | CMOS | ± 7.8 | 12 | low | -40~125 | 78 | 9.1 | 50 | DHVQFN20 |
74HC373D | Production | 2.0 - 6.0 | CMOS | ± 7.8 | 12 | low | -40~125 | 85 | 27.3 | 61 | SO20 |
74HC373PW | Production | 2.0 - 6.0 | CMOS | ± 7.8 | 12 | low | -40~125 | 100 | 4.6 | 44.7 | TSSOP20 |
74HCT373BQ | Production | 4.5 - 5.5 | TTL | ± 6 | 14 | low | -40~125 | 78 | 9.1 | 50 | DHVQFN20 |
74HCT373D | Production | 4.5 - 5.5 | TTL | ± 6 | 14 | low | -40~125 | 85 | 27.3 | 61 | SO20 |
74HCT373PW | Production | 4.5 - 5.5 | TTL | ± 6 | 14 | low | -40~125 | 100 | 4.6 | 44.7 | TSSOP20 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74HC373BQ | DHVQFN20 (SOT764-1) | SOT764-1 | SOT764-1_115 | Active | HC373BQ | 74HC373BQ,115 ( 9352 745 85115 ) | |
74HC373D | SO20 (SOT163-1) | SOT163-1 | WAVE_BG-BD-1 | SOT163-1_653 | Active | 74HC373D | 74HC373D,653 ( 9337 154 70653 ) |
74HC373PW | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_118 | Active | HC373 | 74HC373PW,118 ( 9351 652 40118 ) |
74HCT373BQ | DHVQFN20 (SOT764-1) | SOT764-1 | SOT764-1_115 | Active | HCT373BQ | 74HCT373BQ,115 ( 9352 745 84115 ) | |
74HCT373D | SO20 (SOT163-1) | SOT163-1 | WAVE_BG-BD-1 | SOT163-1_653 | Active | 74HCT373D | 74HCT373D,653 ( 9337 155 80653 ) |
74HCT373PW | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_118 | Active | HCT373 | 74HCT373PW,118 ( 9351 748 30118 ) |
下表中的版本已停产。参见表 停产信息 了解更多信息。
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74HCT373PW | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_112 | Withdrawn / End-of-life | HCT373 | 74HCT373PW,112 ( 9351 748 30112 ) |
停产信息
型号 | 可订购的器件编号,(订购码(12NC)) | 最后一次购买日期 | 最后一次交货日期 | 替代产品 | 状态 | 备注 |
---|---|---|---|---|---|---|
74HC373D | 933715470652 | 2021-12-31 | 2022-06-30 | 74HC373D | ||
74HC373PW | 935165240112 | 2021-12-31 | 2022-06-30 | 74HC373PW | ||
74HCT373D | 933715580652 | 2021-12-31 | 2022-06-30 | 74HCT373D | ||
74HCT373PW | 935174830112 | 2021-12-31 | 2022-06-30 | 74HCT373PW |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74HC373BQ | 74HC373BQ,115 | 74HC373BQ | Always Pb-free | ||
74HC373D | 74HC373D,653 | 74HC373D | week 30, 2004 | ||
74HC373PW | 74HC373PW,118 | 74HC373PW | week 17, 2005 | ||
74HCT373BQ | 74HCT373BQ,115 | 74HCT373BQ | Always Pb-free | ||
74HCT373D | 74HCT373D,653 | 74HCT373D | week 30, 2004 | ||
74HCT373PW | 74HCT373PW,118 | 74HCT373PW | week 17, 2005 |
下表中的版本已停产。参见表 停产信息 了解更多信息。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74HCT373PW | 74HCT373PW,112 | 74HCT373PW | week 17, 2005 |
文档 (9)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74HC_HCT373 | Octal D-type transparent latch; 3-state | Data sheet | 2021-09-06 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2022-06-20 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
样品
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