特性
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Wide supply voltage range:
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VCC(A): 0.8 V to 3.6 V
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VCC(B): 0.8 V to 3.6 V
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High noise immunity
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CMOS low power dissipation
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Suspend mode
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Latch-up performance exceeds 100 mA per JESD 78 Class II
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Overvoltage tolerant inputs to 3.6 V
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Dynamically controlled outputs
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Low noise overshoot and undershoot < 10 % of VCC
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IOFF circuitry provides partial Power-down mode operation
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Maximum data rates:
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500 Mbit/s (1.8 V to 3.3 V translation)
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320 Mbit/s (< 1.8 V to 3.3 V translation)
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320 Mbit/s (translate to 2.5 V or 1.8 V)
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280 Mbit/s (translate to 1.5 V)
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240 Mbit/s (translate to 1.2 V)
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Complies with JEDEC standards:
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JESD8-12 (0.8 V to 1.3 V)
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JESD8-11 (0.9 V to 1.65 V)
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JESD8-7 (1.65 V to 1.95 V)
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JESD8-5 (2.3 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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ESD protection:
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HBM JESD22-A114E Class 3B exceeds 8000 V
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MM JESD22-A115-A exceeds 200 V
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CDM JESD22-C101C exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
参数类型
Type number | Product status | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74AVC1T45GM | Production | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | 286 | 6.3 | 142 | XSON6 |
74AVC1T45GN | Production | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | 264 | 9.7 | 164 | XSON6 |
74AVC1T45GS | Production | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | 262 | 12.2 | 170 | XSON6 |
74AVC1T45GW | Production | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | 262 | 36.1 | 150 | TSSOP6 |
74AVC1T45GX | Production | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | 470 | 14.6 | 238 | X2SON6 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74AVC1T45GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_132 | Active | B5 | 74AVC1T45GM,132 ( 9352 841 54132 ) |
SOT886_115 | Active | B5 | 74AVC1T45GM,115 ( 9352 841 54115 ) | ||||
74AVC1T45GN | XSON6 (SOT1115) | SOT1115 | REFLOW_BG-BD-1 | SOT1115_132 | Active | B5 | 74AVC1T45GN,132 ( 9352 943 59132 ) |
74AVC1T45GS | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_132 | Active | B5 | 74AVC1T45GS,132 ( 9352 943 61132 ) |
74AVC1T45GW | TSSOP6 (SOT363-2) | SOT363-2 | SOT363-2_125 | Active | B5 | 74AVC1T45GW,125 ( 9352 841 53125 ) | |
74AVC1T45GX | X2SON6 (SOT1255-2) | SOT1255-2 | SOT1255-2_147 | Active | B5 | 74AVC1T45GXZ ( 9353 084 68147 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74AVC1T45GM | 74AVC1T45GM,132 | 74AVC1T45GM | Always Pb-free | ||
74AVC1T45GM | 74AVC1T45GM,115 | 74AVC1T45GM | Always Pb-free | ||
74AVC1T45GN | 74AVC1T45GN,132 | 74AVC1T45GN | Always Pb-free | ||
74AVC1T45GS | 74AVC1T45GS,132 | 74AVC1T45GS | Always Pb-free | ||
74AVC1T45GW | 74AVC1T45GW,125 | 74AVC1T45GW | Always Pb-free | ||
74AVC1T45GX | 74AVC1T45GXZ | 74AVC1T45GX | week 25, 2019 |
文档 (17)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AVC1T45 | Dual-supply voltage level translator/transceiver; 3-state | Data sheet | 2022-02-02 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
avc1t45 | 74AVC1T45 IBIS model | IBIS model | 2016-02-24 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
样品
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