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74AUP2G07

Low-power dual buffer with open-drain output

The 74AUP2G07 is a dual buffer with open-drain outputs. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Low static-power consumption; ICC = 0.9 μA (maximum)

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
74AUP2G07GMProduction0.8 - 3.6CMOS1.9702ultra low-40~125290145XSON6
74AUP2G07GNProduction0.8 - 3.6CMOS1.9702ultra low-40~125275171XSON6
74AUP2G07GSProduction0.8 - 3.6CMOS1.9702ultra low-40~125272177XSON6
74AUP2G07GWProduction0.8 - 3.6CMOS1.9702ultra low-40~125264153TSSOP6
74AUP2G07GXProduction0.8 - 3.6CMOS1.9702ultra low-40~125--X2SON6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP2G07GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132Activep774AUP2G07GM,132
( 9352 799 86132 )
SOT886_115Activep774AUP2G07GM,115
( 9352 799 86115 )
74AUP2G07GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132Activep774AUP2G07GN,132
( 9352 917 61132 )
74AUP2G07GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132Activep774AUP2G07GS,132
( 9352 928 86132 )
74AUP2G07GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125Activep774AUP2G07GW,125
( 9352 799 85125 )
74AUP2G07GX
X2SON6
(SOT1255) 		SOT1255REFLOW_BG-BD-1
SOT1255_147Activep774AUP2G07GXZ
( 9353 070 96147 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74AUP2G07GX935307096125

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP2G07GM74AUP2G07GM,13274AUP2G07GMAlways Pb-free
74AUP2G07GM74AUP2G07GM,11574AUP2G07GMAlways Pb-free
74AUP2G07GN74AUP2G07GN,13274AUP2G07GNAlways Pb-free
74AUP2G07GS74AUP2G07GS,13274AUP2G07GSAlways Pb-free
74AUP2G07GW74AUP2G07GW,12574AUP2G07GWAlways Pb-free
74AUP2G07GX74AUP2G07GXZ74AUP2G07GXAlways Pb-free
品质及可靠性免责声明

文档 (19)

文件名称标题类型日期
74AUP2G07Low-power dual buffer with open-drain outputData sheet2023-07-26
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup2g07aup2g07 IBIS modelIBIS model2015-09-06
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1255plastic, leadless thermal enhanced extremely thin small outline package; 6 terminals; 0.4 mm pitch; 1 mm x 0.8 mm x 0.35 mm bodyPackage information2022-05-31
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
aup2g07aup2g07 IBIS modelIBIS model2015-09-06

样品

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