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74AUP1T45

Low-power dual supply translating transceiver; 3-state

The 74AUP1T45 is a single bit transceiver featuring two data input-outputs (A and B), a direction control input (DIR) and dual supply pins (VCC(A) and VCC(B)) which enable bidirectional level translation. Both VCC(A) and VCC(B) can be supplied at any voltage between 1.1 V and 3.6 V making the device suitable for interfacing between any of the low voltage nodes (1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V). Pins A and DIR are referenced to VCC(A) and pin B is referenced to VCC(B). A HIGH on DIR allows transmission from A to B and a LOW on DIR allows transmission from B to A.

Schmitt trigger action on all inputs makes the circuit tolerant of slower input rise and fall times across the entire VCC(A) and VCC(B) ranges. The device ensures low static and dynamic power consumption and is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing any damaging backflow current through the device when it is powered down. In suspend mode when either VCC(A) or VCC(B) are at GND, both A and B are in the high-impedance OFF-state.

特性

  • Wide supply voltage range:

    • VCC(A): 1.1 V to 3.6 V

    • VCC(B): 1.1 V to 3.6 V

  • High noise immunity

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Suspend mode

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Inputs accept voltages up to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial power-down mode operation

  • Complies with JEDEC standards:

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC(A) (V)VCC(B) (V)Logic switching levelsOutput drive capability (mA)tpd (ns)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1T45GMProduction1.1 - 3.61.1 - 3.6CMOS± 1.915.61ultra low-40~1252976.9149XSON6
74AUP1T45GNProduction1.1 - 3.61.1 - 3.6CMOS± 1.915.61ultra low-40~12529515.5183XSON6
74AUP1T45GSProduction1.1 - 3.61.1 - 3.6CMOS± 1.915.61ultra low-40~12528919.7190XSON6
74AUP1T45GWProduction1.1 - 3.61.1 - 3.6CMOS± 1.915.61ultra low-40~12527043.3158TSSOP6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1T45GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132Activep574AUP1T45GM,132
( 9352 805 14132 )
SOT886_115Activep574AUP1T45GM,115
( 9352 805 14115 )
74AUP1T45GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132Activep574AUP1T45GN,132
( 9352 917 53132 )
74AUP1T45GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132Activep574AUP1T45GS,132
( 9352 928 77132 )
74AUP1T45GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125Activep574AUP1T45GW,125
( 9352 805 13125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1T45GM74AUP1T45GM,13274AUP1T45GMAlways Pb-free
74AUP1T45GM74AUP1T45GM,11574AUP1T45GMAlways Pb-free
74AUP1T45GN74AUP1T45GN,13274AUP1T45GNAlways Pb-free
74AUP1T45GS74AUP1T45GS,13274AUP1T45GSAlways Pb-free
74AUP1T45GW74AUP1T45GW,12574AUP1T45GWAlways Pb-free
品质及可靠性免责声明

文档 (16)

文件名称标题类型日期
74AUP1T45Low-power dual supply translating transceiver; 3-stateData sheet2023-07-20
AN10161PicoGate Logic footprintsApplication note2002-10-29
Nexperia_document_guide_Logic_translatorsNexperia Logic TranslatorsBrochure2021-04-12
aup1t45aup1t45 IBIS modelIBIS model2014-12-21
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
aup1t45aup1t45 IBIS modelIBIS model2014-12-21

样品

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