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74AUP1G57

Low-power configurable multiple function gate

The 74AUP1G57 is a configurable multiple function gate with Schmitt-trigger inputs. The device can be configured as any of the following logic functions AND, OR, NAND, NOR, XNOR, inverter and buffer; using the 3-bit input. All inputs can be connected directly to VCC or GND. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial power-down mode operation

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1G57GMProduction0.8 - 3.6CMOS± 1.98.7701ultra low-40~1252906.5145XSON6
74AUP1G57GNProduction0.8 - 3.6CMOS± 1.98.7701ultra low-40~12527511.7171XSON6
74AUP1G57GSProduction0.8 - 3.6CMOS± 1.98.7701ultra low-40~12527214.8177XSON6
74AUP1G57GWProduction0.8 - 3.6CMOS± 1.98.7701ultra low-40~12526438.6153TSSOP6
74AUP1G57GXProduction0.8 - 3.6CMOS± 1.98.7701ultra low-40~125---X2SON6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G57GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveaC74AUP1G57GM,132
( 9352 799 58132 )
SOT886_115ActiveaC74AUP1G57GM,115
( 9352 799 58115 )
74AUP1G57GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveaC74AUP1G57GN,132
( 9352 917 43132 )
74AUP1G57GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveaC74AUP1G57GS,132
( 9352 928 67132 )
74AUP1G57GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125ActiveaC74AUP1G57GW,125
( 9352 799 57125 )
74AUP1G57GX
X2SON6
(SOT1255-2) 		SOT1255-2SOT1255-2_147ActiveaC74AUP1G57GXZ
( 9353 071 21147 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74AUP1G57GX935307121125

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G57GM74AUP1G57GM,13274AUP1G57GMAlways Pb-free
74AUP1G57GM74AUP1G57GM,11574AUP1G57GMAlways Pb-free
74AUP1G57GN74AUP1G57GN,13274AUP1G57GNAlways Pb-free
74AUP1G57GS74AUP1G57GS,13274AUP1G57GSAlways Pb-free
74AUP1G57GW74AUP1G57GW,12574AUP1G57GWAlways Pb-free
74AUP1G57GX74AUP1G57GXZ74AUP1G57GXAlways Pb-free
品质及可靠性免责声明

文档 (19)

文件名称标题类型日期
74AUP1G57Low-power configurable multiple function gateData sheet2023-07-24
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g57aup1g57 IBIS modelIBIS model2015-09-06
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_SingleConfigurableLogic_201812Single configurable logicLeaflet2019-01-04
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
SOT1255-2plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mmPackage information2020-08-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
aup1g57aup1g57 IBIS modelIBIS model2015-09-06

样品

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