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74AUP1G34

Low-power buffer

The 74AUP1G34 is a single buffer. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial power-down mode operation

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
74AUP1G34GMProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125311157XSON6
74AUP1G34GNProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125334207XSON6
74AUP1G34GSProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125321215XSON6
74AUP1G34GWProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125309179TSSOP5
74AUP1G34GXProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125322191X2SON5
74AUP1G34GX4Production0.8 - 3.6CMOS± 1.9701ultra low-40~125--X2SON4

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G34GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveaN74AUP1G34GM,132
( 9352 790 29132 )
SOT886_115ActiveaN74AUP1G34GM,115
( 9352 790 29115 )
74AUP1G34GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveaN74AUP1G34GN,132
( 9352 917 37132 )
74AUP1G34GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveaN74AUP1G34GS,132
( 9352 928 62132 )
74AUP1G34GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActiveaN74AUP1G34GW,125
( 9352 790 28125 )
74AUP1G34GW/C7
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActiveaN74AUP1G34GW/C7H
( 9356 919 30125 )
74AUP1G34GX
X2SON5
(SOT1226) 		SOT1226REFLOW_BG-BD-1
SOT1226_125ActiveaN74AUP1G34GX,125
( 9352 983 63125 )
74AUP1G34GX4
X2SON4
(SOT1269-2) 		SOT1269-2SOT1269-2_147ActiveaN74AUP1G34GX4Z
( 9353 401 18147 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G34GM74AUP1G34GM,13274AUP1G34GMAlways Pb-free
74AUP1G34GM74AUP1G34GM,11574AUP1G34GMAlways Pb-free
74AUP1G34GN74AUP1G34GN,13274AUP1G34GNAlways Pb-free
74AUP1G34GS74AUP1G34GS,13274AUP1G34GSAlways Pb-free
74AUP1G34GW74AUP1G34GW,12574AUP1G34GWAlways Pb-free
74AUP1G34GW/C774AUP1G34GW/C7H74AUP1G34GW/C7
74AUP1G34GX74AUP1G34GX,12574AUP1G34GXAlways Pb-free
74AUP1G34GX474AUP1G34GX4Z74AUP1G34GX4week 25, 2019
品质及可靠性免责声明

文档 (22)

文件名称标题类型日期
74AUP1G34Low-power bufferData sheet2023-07-13
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g3474AUP1G34 IBIS modelIBIS model2018-05-25
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT1226MAR_SOT1226 TopmarkTop marking2013-06-03
SOT1226plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm bodyPackage information2022-05-30
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1269-2plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm bodyPackage information2020-08-18

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模型

文件名称标题类型日期
aup1g3474AUP1G34 IBIS modelIBIS model2018-05-25

样品

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