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74AUP1G157

Low-power 2-input multiplexer

The 74AUP1G157 is a single 2-input multiplexer. Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Low static power consumption; ICC = 0.9 µA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1G157GMProduction0.8 - 3.6CMOS1.9 / -1.93.2ultra low-40~1252906.5145XSON6
74AUP1G157GNProduction0.8 - 3.6CMOS1.9 / -1.93.2ultra low-40~12527511.7171XSON6
74AUP1G157GSProduction0.8 - 3.6CMOS1.9 / -1.93.2ultra low-40~12527214.8177XSON6
74AUP1G157GWProduction0.8 - 3.6CMOS1.9 / -1.93.2ultra low-40~12526438.6153TSSOP6
74AUP1G157GXProduction0.8 - 3.6CMOS1.9 / -1.93.2ultra low-40~1254379.4211X2SON6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G157GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveaP74AUP1G157GM,132
( 9352 799 71132 )
SOT886_115ActiveaP74AUP1G157GM,115
( 9352 799 71115 )
74AUP1G157GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveaP74AUP1G157GN,132
( 9352 917 26132 )
74AUP1G157GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveaP74AUP1G157GS,132
( 9352 928 51132 )
74AUP1G157GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125ActiveaP74AUP1G157GW,125
( 9352 799 69125 )
74AUP1G157GX
X2SON6
(SOT1255) 		SOT1255REFLOW_BG-BD-1
SOT1255_147ActiveaP74AUP1G157GXZ
( 9353 073 58147 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74AUP1G157GX935307358125

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G157GM74AUP1G157GM,13274AUP1G157GMAlways Pb-free
74AUP1G157GM74AUP1G157GM,11574AUP1G157GMAlways Pb-free
74AUP1G157GN74AUP1G157GN,13274AUP1G157GNAlways Pb-free
74AUP1G157GS74AUP1G157GS,13274AUP1G157GSAlways Pb-free
74AUP1G157GW74AUP1G157GW,12574AUP1G157GWAlways Pb-free
74AUP1G157GX74AUP1G157GXZ74AUP1G157GXAlways Pb-free
品质及可靠性免责声明

文档 (19)

文件名称标题类型日期
74AUP1G157Low-power 2-input multiplexerData sheet2023-07-12
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g157aup1g157 IBIS modelIBIS model2014-12-21
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1255plastic, leadless thermal enhanced extremely thin small outline package; 6 terminals; 0.4 mm pitch; 1 mm x 0.8 mm x 0.35 mm bodyPackage information2022-05-31
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
aup1g157aup1g157 IBIS modelIBIS model2014-12-21

样品

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