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    74AUP1G07

    Low-power buffer with open-drain output

    The 74AUP1G07 is a single buffer with open-drain output.

    Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

    This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

    This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

    特性

    • Wide supply voltage range from 0.8 V to 3.6 V

    • High noise immunity

    • CMOS low power dissipation

    • Complies with JEDEC standards:

      • JESD8-12 (0.8 V to 1.3 V)

      • JESD8-11 (0.9 V to 1.65 V)

      • JESD8-7 (1.65 V to 1.95 V)

      • JESD8-5 (2.3 V to 2.7 V)

      • JESD8C (2.7 V to 3.6 V)

    • Low static power consumption; ICC = 0.9 μA (maximum)

    • Latch-up performance exceeds 100 mA per JESD 78 Class II

    • Overvoltage tolerant inputs to 3.6 V

    • Low noise overshoot and undershoot < 10 % of VCC

    • IOFF circuitry provides partial Power-down mode operation

    • Multiple package options

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C

    参数类型

    Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
    74AUP1G07GF
    NRND
    Not for design in---------XSON6
    74AUP1G07GMProduction0.8 - 3.6CMOS1.9701ultra low-40~125311157XSON6
    74AUP1G07GNProduction0.8 - 3.6CMOS1.9701ultra low-40~125334207XSON6
    74AUP1G07GSProduction0.8 - 3.6CMOS1.9701ultra low-40~125321215XSON6
    74AUP1G07GWProduction0.8 - 3.6CMOS1.9701ultra low-40~125309179TSSOP5
    74AUP1G07GXProduction0.8 - 3.6CMOS1.9701ultra low-40~125322191X2SON5
    74AUP1G07GX4Production0.8 - 3.6CMOS1.9701ultra low-40~125--X2SON4

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
    74AUP1G07GM
    XSON6
    (SOT886)
    SOT886REFLOW_BG-BD-1
    SOT886_132ActivepS74AUP1G07GM,132
    ( 9352 790 18132 )
    SOT886_115ActivepS74AUP1G07GM,115
    ( 9352 790 18115 )
    74AUP1G07GN
    XSON6
    (SOT1115)
    SOT1115REFLOW_BG-BD-1
    SOT1115_132ActivepS74AUP1G07GN,132
    ( 9352 917 16132 )
    74AUP1G07GS
    XSON6
    (SOT1202)
    SOT1202REFLOW_BG-BD-1
    SOT1202_132ActivepS74AUP1G07GS,132
    ( 9352 928 31132 )
    74AUP1G07GW
    TSSOP5
    (SOT353-1)
    SOT353-1WAVE_BG-BD-1
    SOT353-1_125ActivepS74AUP1G07GW,125
    ( 9352 790 17125 )
    74AUP1G07GX
    X2SON5
    (SOT1226-3)
    SOT1226-3SOT1226-3_125ActivepS74AUP1G07GX,125
    ( 9352 979 26125 )
    74AUP1G07GX4
    X2SON4
    (SOT1269-2)
    SOT1269-2SOT1269-2_147ActivepS74AUP1G07GX4Z
    ( 9353 401 15147 )

    停产信息

    型号可订购的器件编号,(订购码(12NC))最后一次购买日期最后一次交货日期替代产品状态备注
    74AUP1G07GF9352811081322021-06-302021-12-3174AUP1G07GS

      环境信息

      型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
      74AUP1G07GM74AUP1G07GM,13274AUP1G07GMAlways Pb-free
      74AUP1G07GM74AUP1G07GM,11574AUP1G07GMAlways Pb-free
      74AUP1G07GN74AUP1G07GN,13274AUP1G07GNAlways Pb-free
      74AUP1G07GS74AUP1G07GS,13274AUP1G07GSAlways Pb-free
      74AUP1G07GW74AUP1G07GW,12574AUP1G07GWAlways Pb-free
      74AUP1G07GX74AUP1G07GX,12574AUP1G07GXAlways Pb-free
      74AUP1G07GX474AUP1G07GX4Z74AUP1G07GX4week 25, 2019
      品质及可靠性免责声明

      文档 (23)

      文件名称标题类型日期
      74AUP1G07Low-power buffer with open-drain outputData sheet2023-07-11
      AN10161PicoGate Logic footprintsApplication note2002-10-29
      AN11052Pin FMEA for AUP familyApplication note2019-01-09
      aup1g0774AUP1G07 IBIS modelIBIS model2014-12-14
      Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
      Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
      Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
      REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
      MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
      SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
      WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
      SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
      REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
      MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
      SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
      SOT891plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm bodyPackage information2020-04-21
      MAR_SOT891MAR_SOT891 TopmarkTop marking2013-06-03
      REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
      MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
      SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
      REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
      SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27
      SOT1269-2plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm bodyPackage information2020-08-18

      支持

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      模型

      文件名称标题类型日期
      aup1g0774AUP1G07 IBIS modelIBIS model2014-12-14

      样品

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