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    化学成分 PSMN9R3-60HS

    作为一家积极进取的可持续发展公司,安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息,恩智浦可以向我们的客户提供相关资料,以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据,这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

    型号封装封装说明总产品重量
    PSMN9R3-60HSSOT1205LFPAK56D98.95000 mg
    12NC版本无铅焊接焊接处理周期数组装厂RHF指示符
    MSLPPTMPPTMSLPPTMPPT
    9346653891152126030 s126020 s3Dongguan, China; Sherman, United States Of America; Newport, United Kingdom; Manchester, United Kingdom; Cabuyao, Philippines; Hsin-chu, TaiwanLeaded
    次组件材料组物质CAS登录号重量(毫克)次组件重量(%)总产品重量(%)
    DieDoped siliconSilicon (Si)7440-21-34.00000100.000004.04245
    subTotal4.00000100.000004.04245
    ClipCopper alloyCopper (Cu)7440-50-813.1736099.8000013.31339
    Iron (Fe)7439-89-60.019800.150000.02001
    Phosphorus (P)7723-14-00.006600.050000.00667
    subTotal13.20000100.0000013.34007
    Lead FrameCopper alloyCopper (Cu)7440-50-835.3292099.8000035.70409
    Iron (Fe)7439-89-60.053100.150000.05366
    Phosphorus (P)7723-14-00.017700.050000.01789
    subTotal35.40000100.0000035.77564
    Mould CompoundAdditiveNon hazardousProprietary0.456401.400000.46124
    FillerSilica -amorphous-7631-86-92.053806.300002.07559
    Silica fused60676-86-023.4720072.0000023.72107
    Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.652002.000000.65892
    PigmentCarbon black1333-86-40.097800.300000.09884
    Polymer2,2'-[[[(oxiranylmethoxy)phenyl]methylene]bis[[(1,1-dimethylethyl)methylphenylene]oxymethylene]]bisoxirane129915-35-11.956006.000001.97676
    Bromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.717202.200000.72481
    Non hazardousProprietary1.434404.400001.44962
    Phenol Formaldehyde resin (generic)9003-35-41.760405.400001.77908
    subTotal32.60000100.0000032.94593
    Post-PlatingImpurityNon hazardousProprietary0.000190.010000.00020
    Tin alloyTin (Sn)7440-31-51.9298199.990001.95028
    subTotal1.93000100.000001.95048
    Solder PasteLead alloyLead (Pb)7439-92-12.5530092.500002.58009
    Silver (Ag)7440-22-40.069002.500000.06973
    Tin (Sn)7440-31-50.138005.000000.13946
    subTotal2.76000100.000002.78928
    Solder PasteImpurityAntimony (Sb)7440-36-00.002720.030000.00275
    Lead alloyLead (Pb)7439-92-18.3777892.470008.46668
    Silver (Ag)7440-22-40.226502.500000.22890
    Tin (Sn)7440-31-50.453005.000000.45781
    subTotal9.06000100.000009.15614
    total98.95000100.00000100.00000
    备注:
    1 此处是对使用物质的通用描述,因实际组成物质为专有成分,也没有正式的CAS登录号。如果有CAS登录号,此处显示最接近的结果。
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