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    化学成分 BC846S

    作为一家积极进取的可持续发展公司,安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息,恩智浦可以向我们的客户提供相关资料,以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据,这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

    型号封装封装说明总产品重量
    BC846SSOT363SC-885.61326 mg
    12NC版本无铅焊接焊接处理周期数组装厂RHF指示符
    MSLPPTMPPTMSLPPTMPPT
    934055429125812601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China; Suqian, China 
    934055429135212601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Suqian, China; Dongguan, China 
    9340554291151212601235Dongguan, China; Seremban, Malaysia; Suqian, China; D-22529 HAMBURG, Germany 
    934055429165212601235Suqian, China; D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
    次组件材料组物质CAS登录号重量(毫克)次组件重量(%)总产品重量(%)
    DieDoped siliconSilicon (Si)7440-21-30.08000100.000001.42520
    subTotal0.08000100.000001.42520
    DieDoped siliconSilicon (Si)7440-21-30.08000100.000001.42520
    subTotal0.08000100.000001.42520
    DieDoped siliconSilicon (Si)7440-21-30.08000100.000001.42520
    subTotal0.08000100.000001.42520
    Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03319
    Carbon (C)7440-44-00.000830.040000.01475
    Chromium (Cr)7440-47-30.004350.210000.07744
    Cobalt (Co)7440-48-40.008900.430000.15857
    Iron (Fe)7439-89-60.9811847.4000017.47968
    Manganese (Mn)7439-96-50.017600.850000.31345
    Nickel (Ni)7440-02-00.7392035.7100013.16876
    Phosphorus (P)7723-14-00.000410.020000.00738
    Silicon (Si)7440-21-30.005380.260000.09588
    Sulphur (S)7704-34-90.000410.020000.00738
    Pure metal layerCopper (Cu)7440-50-80.2713813.110004.83457
    Silver (Ag)7440-22-40.038501.860000.68591
    subTotal2.07000100.0000036.87696
    Mould CompoundFillerSilica fused60676-86-02.1929275.1000039.06678
    PigmentCarbon black1333-86-40.008760.300000.15606
    PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5110017.500009.10344
    Phenol Formaldehyde resin (generic)9003-35-40.207327.100003.69340
    subTotal2.92000100.0000052.01968
    Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
    Bismuth (Bi)7440-69-90.000000.001000.00007
    Copper (Cu)7440-50-80.000000.001000.00007
    Lead (Pb)7439-92-10.000020.005000.00033
    Tin solderTin (Sn)7440-31-50.3699699.990006.59088
    subTotal0.37000100.000006.59155
    WirePure metalCopper (Cu)7440-50-80.01326100.000000.23624
    subTotal0.01326100.000000.23624
    total5.61326100.00000100.00000
    备注:
    1 此处是对使用物质的通用描述,因实际组成物质为专有成分,也没有正式的CAS登录号。如果有CAS登录号,此处显示最接近的结果。
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