Top-side and bottom-side cooling
For added flexibility in designs and to further improve heat dissipation, CCPAK is available in both top-side cooling and traditional bottom-side cooling package designs.
The first in the portfolio of GaN SMD packages, the CCPAK1212 and CCPAK1212i have a compact footprint of only 12 x 12 mm and a low package height of 2.5 mm.
CCPAK GaN FETs videos
Copper-clip SMD CCPAK GaN FET package in half-bridge evalsuation board
主要特性和优势
- Copper-clip
- 3 times lower inductances than industry-standard packages for lower switching losses and EMI
- Higher reliability compared to wire-bond solution
- Thermal performance
- Low Rth(j-mb) typ (<0.5 K/W) for optimal cooling
- 175 °C Tj max
- Manufacturability and robustness
- Flexible leads for temperature cycling reliability
- Flexible gull winged leads for robust board level reliability
- Compatible with SMD soldering and AOI
- Two cooling options
- Bottom-side cooling (CCPAK1212)
- Top-side cooling (CCPAK1212i)
- Plan for Qualifications
- AEC-Q101
- MSL1
- Halogen free
关键应用
- Automotive EV
- On board charging
- DC-to-DC converters
- Traction inverters
- Industrial
- Telecom and server Titanium grade power supplies
- Industrial vehicle charging
- Solar (PV) inverter
- AC servo drive / Frequency inverters
- Battery storage/UPS inverters
Parametric search
Products
GaN FETs
型号 | 描述 | 状态 | 快速访问 |
---|---|---|---|
GAN039-650NBB | 650 V, 33 mOhm Gallium Nitride (GaN) FET in a CCPAK1212 package | Qualification | |
GAN039-650NTB | 650 V, 33 mOhm Gallium Nitride (GaN) FET in a CCPAK1212i package | Production |
Documentation
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
AN90005 | Understanding Power GaN FET data sheet parameters | Application note | 2020-06-08 |
AN90004 | Probing considerations for fast switching applications | Application note | 2019-11-15 |
AN90006 | Circuit design and PCB layout recommendations for GaN FET half bridges | Application note | 2019-11-15 |
RS3138_SOT8005_Combi_2_scr | CCPAK1212i (SOT8005) package image | Marcom graphics | 2020-05-26 |
nexperia_whitepaper_gan_robustness_aecq101 | White paper: GaN FET technology and the robustness needed for AEC-Q101 qualification | White paper | 2020-06-08 |
nexperia_whitepaper_gan_robustness_aecq101_CN | Whitepaper: GaN FET technology and the robustness needed for AEC-Q101 qualification – Chinese (650 V GaN FET技术可提供 出色效率,以及AEC-Q101 认证所需的耐用性) | White paper | 2020-07-15 |
TN90004 | An insight into Nexperia Power GaN technology – Applications, quality, reliability and scalability | Technical note | 2020-07-21 |
nexperia_whitepaper_gan_need_for_efficient_conversion | White paper: Power GaN technology: the need for efficient power conversion | White paper | 2020-07-23 |
nexperia_whitepaper_gan_need_for_efficient_conversion_CHN | 白皮书: 功率GaN技术: 高效功率转换的需求 | White paper | 2020-08-17 |
Nexperia_document_book_MOSFETGaNFETApplicationHandbook_2020 | MOSFET & GaN FET Application Handbook | User manual | 2020-11-05 |
nexperia_whitepaper_gan_need_for_efficient_conversion_Japanese | Whitepaper: GaN need for efficient conversion (Japanese) | White paper | 2021-05-20 |
AN90030 | Paralleling of Nexperia cascode GaN FETs in half-bridge topology | Application note | 2023-03-22 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
nexperia_document_leaflet_GaNFETs_2023 | Power GaN FETs leaflet | Leaflet | 2023-10-25 |
nexperia_document_leaflet_GaNFETs_2023_CHN | Power GaN FETs leaflet | Leaflet | 2023-10-25 |
nexperia_document_leaflet_GaN_CCPAK_2023 | CCPAK GaN FETs | Leaflet | 2023-10-25 |
nexperia_document_leaflet_GaN_CCPAK_2023_CHN | CCPAK GaN FETs Chinese | Leaflet | 2023-10-25 |
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Datasheets (2)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
GAN039-650NBB | 650 V, 33 mOhm Gallium Nitride (GaN) FET in a CCPAK1212 package | Data sheet | 2024-05-28 |
GAN039-650NTB | 650 V, 33 mOhm Gallium Nitride (GaN) FET in a CCPAK1212i package | Data sheet | 2023-12-05 |